Product
NEMST-D2002 系列
Vertical Plasma Desmear Machine (Standard type, 15/28PCS)
Standard type, 15/28PCS
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- Unique Plasma Technology integrated with Inductively Coupling Plasma (ICP) and Hollow Cathode Plasma (HCP) design.
- ICP & HCP are generated at the same time and it can substantially increase the plasma density as well as the process speed.
- By employing water-cooling electrodes, the resistance of electrode surface can remain the same and thus increases the process stability. Multiple Processing Gas Selectivity. Mutiple Easy-Maintain and Low-Maintenance-Cost Designs.
- High Automation and Operator Friendly Design.
- Depending on the customer's requirements, the machine can be produced in some customized designs.
- Stepwise processing is available.
- Convenient Cart/Rack Loading/Unloading Designs.
- High Plasma Desmear Uniformity. Very High Plasma Desmear Efficiency.
- Multiple Process Gases Selectivity (CF4, O2, N2, Ar, H2 and etc.) to achieve the best surface treatment effects.
- High Capability (15/28 panels, 510 mm x 610 mm or 60/112 panels, 200 mm x 250 mm / Rigid, Flex, Rigid-Flex Boards).
- Very High Plasma Desmear Efficiency.
- Desmear / Descum / Cleaning.
- Blind Vias and Through Holes Plasma Treatment. Interlayer Adhesion Promotion.
- Resist / Emulsion Removal.
- Surface Activation / Surface Roughness Improvement / Surface Modification.